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Technology 生产技术


NO.OF LAYER 层数                            1-20 layer


Main Base Material 主要板材             FR1,FR2,FR4,CEM1,CEM3,High Frequency Laminate with various dielectric constant(imported or from local supplier), 

                                                        Aluminum base laminate,metal core Aluminum                                                        FR-1,FR-2,FR-4,CEM-1,CEM-3,各种介电常数的高频板,铝基板, 金属铝基板


Board Thickness 板厚                     Inner core thickness 0.15-1.5mm,finish board thickness 0.2-3.0mm

                                                        内层板厚0.15-1.5mm,成品板厚:0.2-3.0mm


Copper Foil Thickness                   1/3OZ-6OZ

         铜箔厚度


Process Size 可制作尺寸                  2-1200MM


Min Line Width/Line Space            0.076/0.076 mm,3mil/3mil

最小线宽线距 


Min Drilling Diameter                    0.2mm/8mil

最小钻孔直径


Min  Punch Diameter                      0.8mm

最小冲孔直径


Tolerance公差


 

Drilling Position 钻孔位置               ±0.05 mm


Line Width 线宽                               ±10%


Diameter 直径                                 ±0.076mm


Outline Tolerance                           ±0.05mm(Routing 锣边)±0.13mm(Punching 冲板)

成型外形公差     


Size Tolerance                                ±0.1mm


Warpage板翘                                  ≤0.70%


Surface Finish  表面处理工艺           Hot air Leveling(HAL),Electroless Ni/Immersion Au,OSP,Coating,Hard gold plating,Immersion Tin                                                          喷锡,化学镀镍/沉金,镀金,抗氧化,镀硬金,沉锡,松香


V-CUT Size V割尺寸                        Computer V-CUT 1200*600mm,  Manual V-CUT 300*300 mm


Board Thickness板厚                     Computer V-CUT 3.0 mm,  Manual V-CUT 1.6mm


Tolerance公差                               ±0.10mm


Drilled Slot Width钻槽宽度            0.60mm


 Angle角度                                     30°,45°,90°


Drilled Slot Tolerance钻槽公差     ±0.076 mm


Roundness Deviation 圆度偏差         ±0.05 mm


Multilayer registration of layer to layer 多层板压合  


Layer to layer Alignment Tolerance       ±0.05 mm

层与层的对齐公差


Tolerance of board thickness                ±10% 

板厚公差


Impedance 阻抗                                    % ±10